Home  >  SUNTABA vacuum pallets  >  Micro / Mini LED​ Process
「SUNTABA vacuum pallets」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.

Micro / Mini LED​ Process

Micro LED mass transfer technology involves transferring hundreds of thousands to millions of micron-scale LED chips rapidly and precisely from the wafer to the display backplane.
This process requires high-precision alignment, low damage, and high yield. Even the slightest deviation or scratch can affect display quality and production yield. Substrate warpage caused by surface non-uniformity often leads to reduced efficiency and yield in the transfer process.
By applying the principle of vacuum adsorption with a high-flatness silicone layer and uniform suction force, SUNTABA® can securely hold Micro LED chips or transfer fixtures during mass transfer, preventing warpage and displacement without leaving adhesive residue.
Its reusability not only reduces consumable costs but also maintains stable performance in high-precision equipment.
Using SUNTABA® in Micro LED mass transfer significantly improves alignment accuracy, reduces yield loss, and ensures both production efficiency and process cleanliness — providing an efficient and reliable solution for next-generation display manufacturing.
  1. Snake-scale exhaust design: Effectively releases gases generated at high temperatures, preventing bubble retention.
  2. Customizable adsorption area: Flexible design to accommodate different product sizes and shapes.
  3. Supports both flexible and rigid substrates: Applicable to various substrate types.
  4. High-temperature resistance: Suitable for processes up to 250 °C.
  5. Outstanding durability: Reusable, resistant to molding pressure, low dust generation, and washable.
SUNTABA
Thickness
T2 PLUS (green)
0.5 mm ​± 0.05
T2 (black)
0.5 mm ​± 0.05
Carrier Material
Deformation
quartz glass
0.1 mm
stononlead
0.6 mm

​This technology not only mitigates substrate thermal expansion issues during processing but also resolves downstream challenges in die bonding and wire bonding caused by deformation, ensuring greater stability in high-precision packaging processes.

​MINI LED suntaba vacuum pALlEtS applications

Micro LED mass transfer technology involves transferring hundreds of thousands to millions of micron-scale LED chips rapidly and precisely from the wafer to the display backplane.
In Mini LED assembly, there are processes such as printing, solder paste inspection, placement, reflow soldering, automatic visual inspection, dispensing and baking...etc. The thinner the board, the more "high performance materials" combined with "high precision" carriers are required to complete these processes.
​
In the past, tape was used to fix the position of the substrate to ensure no displacement in the aforementioned part of the process, but it cannot meet the current manufacturing process applications of Mini LED. Gactors include disadvantages such as the uncertainty of fixing around or at the bottom of the substrate, the thickness of the tape interfering with the print quality, the labor consumption, and the inability to enter automatic production.
 processes, so that mini LED production processes are more efficient.
SUNTABA VACUUM MAGNETIC PALLETS
Due to the requirement of equipment and various production conditions, the carrier must feature all required functions such as flatness, high temperature resistance, prevention of substrate deformation, easy separation, and reuse, etc. Sunny Process has developed the SUNTABA vacuum magnetic plate to help resolve production problems and improve efficiency and yield.
磁吸貼霸載具
↑↑ SUNTABA vacuum magnetic pallets -- front-end process ↑↑ 
Applications