Suntaba vacuum pallets

Home > Applications of Suntaba > SUNTABA VACUUM PALLETS

【SUNTABA VACuum pallets】

suntaba_vacuum_pallets.pdf
File Size:	1531 kb
File Type:	pdf

下載檔案

「SUNTABA vacuum pallets」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.

Just set it! The best solution for thin PCB and FPC production!

Due to the thin profile of mobile devices, circuit boards (PCB, substrate, FPC) are getting thinner and thinner.

So how can we prevent deformation when producing ultra-thin PCB?
How do we fix the board into position and remove the PCB when it is so thin?
How do we automate the production of thin boards?

Based on the above issues, we developed the Suntaba Vacuum pallets, which uses the vacuum suction principle to replace the traditional taping methods. Solve the above problems easily and move towards automatic production.

Suntaba_msds.pdf
File Size:	260 kb
File Type:	pdf

下載檔案

Particle_Test.pdf
File Size:	316 kb
File Type:	pdf

下載檔案

Suntaba(T0)_SGS(2021).pdf
File Size:	450 kb
File Type:	pdf

下載檔案

Suntaba(T2)_SGS(2021).pdf
File Size:	450 kb
File Type:	pdf

下載檔案

SUNTABA can be custom designed according to different products and manufacturing.

SUNTABA design：If the SUNTABA is used with full glossy surface, the adsorption strength may be too large, causing the substrate to be deformed or damaged when separated.
After design, the adsorption area and adsorption strength of the sticker can be determined and adjusted.

Round hole design：with the use of manual and automatic ejectors, the rounded design can adjust the strength of each ejector hole on the Suntaba.
Polka dot design：The polka dot design of the non-adsorption area can effectively reduce the adsorption force in the target area.
Striped design：The striped design of the non-adsorption area can effectively reduce the adsorption force by 50% in the target area.
Irregular design：For complex and irregular substrates, special shapes can be custom designed.
Snake-scale design：Sunny Process's newly developed "Snake-scale technology" is designed for high end packaging and semiconductor production processes. It can regulate the thermal expansion of the packaging process when exposed to heat

貼霸的設計與應用.pdf
File Size:	552 kb
File Type:	pdf

下載檔案

advantages

The lifetime of SUNTABA is more than 1,500 : vacuum adsorption technology is adopted so no tape is required (the lifetime of Suntaba varies depending on the use method and environment).
Cost-saving : SUNTABA can be replaced so carriers can be reused.
Improved production yield : prevent FPC deformation during production.
Complex FPC layout design : precision cutting (±0.1 mm).
SUNTABA can be designed with partial adsorption surface : the adsorption and non-adsorption area can be realized on the same in-place sticker.
Convenient automatic production : can be quickly positioned and detached.
Small thermal expansion coefficient : automatic production, to avoid fixture deformation and production line jamming issues. (Reference materials)
SUNTABA can be reused to solve tape waste contamination.
Anti-static SUNTABA is also available (10E5~10E8 Ω).
Can be used with hand-held dusting roller to improve cleanliness.

Suntaba can be designed with partial adsorption surface.

Can be used with hand-held dusting roller

NOTES

The thermal conductivity of aluminum is high, which can easily affect the lifetime of the SUNTABA. Pay attention to the material selection of the carriers. It is recommended to use stononlead or low thermal conductivity materials.
Please don’t place the PCB on the SUNTABA when not in production to avoid chemical reaction and bonding together.
Do not use toluene, acetone, IPA and other substances on SUNTABA.
To clean your SUNTABA, it is recommended to use hand-held dust roller, neutral detergent + water.
The useful lifetime of the SUNTABA will be affected by duration and temperature during use.
After the PCB is completed, it is recommended that the board be ejected at a temperature of about 50 ~ 60°C to prevent damage to the PCB.
If the board’s RA value is greater than 0.1, it is recommended to use the SUNTABA T0.

feature

貼霸特性表.pdf
File Size:	437 kb
File Type:	pdf

下載檔案

SUNTABA test

Ejecting Force Test
Acid and Alkali Resistance Test
Lifetime Test
ESD & Surface Resistance Test
ASTM E595 Test

sUNTABA EJECTING FORCE TEST 1

This tests the force required for SUNTABA to eject the PET film (thickness 0.07mm).
The area in black is the adsorption area. [Measurement data for reference only].

SUNTABA T0 -- Ejecting Force Test Results

A	1.5 mm	2 mm	3 mm	4 mm
Max (g)	47	59	79	105
Min (g)	27	40	56	70
Average (g)	35	50	65	95

SUNTABA T2 -- Ejecting Force Test Results

A	1.5 mm	2 mm	3 mm	4 mm
Max (g)	26	42	58	66
Min (g)	23	30	42	52
Average (g)	25	35	50	60

SUNTABA EJECTING FORCE TEST 2

This tests the force required by SUNTABA T2 to eject the glass (thickness 1.1mm). The area in black is the adsorption area.
[Measurement data for reference only].

B	4.7 mm	3 mm
Max (g)	900	710
Min (g)	660	540
Average (g)	715	635

Suntaba Acid and Alkali Resistance Test

DIP TIME：1 HR

CHEMICAL	CONC.	TEMP	RESULT
KOH	1%	R.T	OK
Na2CO3	1%	R.T	OK
NaOH	1%	R.T	OK
NaOH	5%	R.T	OK
NaOH	5%	50℃	OK
FeCl3	-	R.T	OK
FeCl3	-	50℃	OK
CuCl2	-	R.T	OK
CuCl2	-	50℃	OK
HCl + H2O2	30% / 30%	R.T	OK
Ti etching	5%	R.T	OK

suntaba T2 lifetime test

( cold and hot shock test 1500 cycles )

Test method : SUNTABA T2 is heated at high temperature and pressed down on the "contact material" for 5 minutes, then cooled down and removed from the "contact material". This is repeated over many cycles.

SUNTABA	contact material	heated cooled	time	number
T2	0.2mm Stononlead®	260℃ 175℃	5 minute	1,500

Test result : After 1,500 hot and cold shocks, the SUNTABA T2 still has adsorption effects, and impurities are found on the surface (which can be cleaned with alcohol wipe).

貼霸T2__冷熱衝擊1500測試.pdf
File Size:	1724 kb
File Type:	pdf

下載檔案

test before

test after which can be cleaned with alcohol wipe)