DIP
DIP （dual in-line package）is a method for producing electronic circuits in which the components are secured to a PCB by inserting the pins through holes in the board and soldering them in place.
Its main steps are as : Components Insertion --> Spray the Flux -->Wave Soldering --> Inspection.
Following are the main functions by using the DIP fixture in the aforesaid process steps：
Usually the DIP will be fabricated from FR4, however it is shorter in life and the fixture is also vulnerable to damage as to cause a defect when operated under higher temperature for longer time.
When encountering the aforesaid problem, it is suggested that you may use stononlead for making improvements.
Its main steps are as : Components Insertion --> Spray the Flux -->Wave Soldering --> Inspection.
Following are the main functions by using the DIP fixture in the aforesaid process steps：
- Keep the circuit board on a flat status and properly supported.
- Shield the SMD components to avoid contamination by the flux.
- Shield the SMD components to prevent them from falling when passing the Soldering Oven.
Usually the DIP will be fabricated from FR4, however it is shorter in life and the fixture is also vulnerable to damage as to cause a defect when operated under higher temperature for longer time.
When encountering the aforesaid problem, it is suggested that you may use stononlead for making improvements.
