Home > SUNTABA VACUUM PALLETS
【SUNTABA VACUUM PALLETS】 |
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「SUNTABA vacuum pallets」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.
Just set it! The best solution for thin PCB and FPC production!
Due to the thin profile of mobile devices, circuit boards (PCB, substrate, FPC) are getting thinner and thinner.
- So how can we prevent deformation when producing ultra-thin PCB?
- How do we fix the board into position and remove the PCB when it is so thin?
- How do we automate the production of thin boards?
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SUNTABA can be custom designed according to different products and manufacturing.
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SUNTABA design：If the SUNTABA is used with full glossy surface, the adsorption strength may be too large, causing the substrate to be deformed or damaged when separated.
After design, the adsorption area and adsorption strength of the sticker can be determined and adjusted.
After design, the adsorption area and adsorption strength of the sticker can be determined and adjusted.
- Round hole design：with the use of manual and automatic ejectors, the rounded design can adjust the strength of each ejector hole on the Suntaba.
- Polka dot design：The polka dot design of the non-adsorption area can effectively reduce the adsorption force in the target area.
- Striped design：The striped design of the non-adsorption area can effectively reduce the adsorption force by 50% in the target area.
- Irregular design：For complex and irregular substrates, special shapes can be custom designed.
- Snake-scale design：Sunny Process's newly developed "Snake-scale technology" is designed for high end packaging and semiconductor production processes. It can regulate the thermal expansion of the packaging process when exposed to heat
APPLICATIONS
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Can be combined with automatic load unload device.
Can be used with robotic arms. (Applicable to varying production line methods.) |
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suntaba - fully automatic production process |
suntaba - manual production process |
suntaba - manual ejection |
suntaba - semi-automatic ejection ( full version ) |
advantages
- Durability over 1,500 uses : Adopts vacuum adsorption technology, eliminating the need for adhesive tape. (Actual lifetime may vary depending on usage conditions and environment.)
- Cost-saving : SUNTABA is replaceable while carriers can be reused, reducing consumable costs.
- Improved production yield : prevent FPC deformation and warpage during production.
- Supports complex FPC layouts : precision cutting (±0.1 mm) with customizable design options.
- Partial adsorption design : Adsorption and non-adsorption zones can be realized on the same SUNTABA, flexibly meeting diverse process needs.
- Compatible with automated production : Enables quick positioning and detachment, enhancing manufacturing efficiency.
- Low coefficient of thermal expansion : Maintains stability under high-temperature processes, avoiding fixture deformation and production line jamming issues. (Reference materials)
- Reusable and eco-friendly : Replaces adhesive tape fixation, reducing tape waste and contamination.
- ESD-safe options available : Anti-static versions of SUNTABA® (10^5 ~ 10^8 Ω) are available for electrostatic-sensitive processes.
- Easy to clean : Can be maintained using water or handheld dust-removal rollers to ensure long-term cleanliness and stable adsorption.
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Cleaning Method
To ensure the adsorption performance and extend the service life of SUNTABA vacuum pallets, regular cleaning is required to remove dust, adhesive residue, or other contaminants. Depending on contamination level and usage needs, cleaning methods are divided into dry and wet cleaning.
Dry Cleaning — For Routine Maintenance
Dry cleaning is suitable for daily care, quickly removing surface dust and fine particles to maintain stable adsorption performance.
Dry Cleaning — For Routine Maintenance
Dry cleaning is suitable for daily care, quickly removing surface dust and fine particles to maintain stable adsorption performance.
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Method 1: Silicone dust-removal roller — suitable for light dust and electrostatically attached particles.
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Method 2: Peel-off adhesive roller — suitable for heavier dust or fine particles.
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Wet Cleaning — For Severe Contamination
When the surface accumulates significant contamination such as oil stains or adhesive residue, wet cleaning is recommended to restore optimal adsorption.
When the surface accumulates significant contamination such as oil stains or adhesive residue, wet cleaning is recommended to restore optimal adsorption.
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Method 3: Neutral detergent + water — suitable for cleaning oily or sticky residues.
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NOTES
- Fixture Material: Aluminum has high thermal conductivity, which may affect SUNTABA’s service life. Materials such as lead-free stone or those with lower thermal conductivity are recommended.
- Storage: Do not leave substrates on SUNTABA for extended periods when not in production, to prevent chemical bonding.
- Chemicals: Do not use organic solvents such as toluene, acetone, or IPA on the SUNTABA surface to avoid damage.
- Service Life: The lifespan of SUNTABA varies depending on usage time and operating temperature.
- Separation Recommendation: After PCB processing, it is recommended to release the board at 50–60 °C to minimize PCB damage.
- Model Suggestion: For PCB substrates with RA value > 0.1, SUNTABA T0 model is recommended.
- Cleaning: Clean SUNTABA surfaces appropriately using dry or wet methods to maintain cleanliness and stable adsorption performance.
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SUNTABA test
sUNTABA EJECTING FORCE TEST 1This tests the force required for SUNTABA to eject the PET film (thickness 0.07mm).
The area in black is the adsorption area. [Measurement data for reference only]. |
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SUNTABA T0 -- Ejecting Force Test Results
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SUNTABA T2 -- Ejecting Force Test Results
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SUNTABA EJECTING FORCE TEST 2
This tests the force required by SUNTABA T2 to eject the glass (thickness 1.1mm). The area in black is the adsorption area.
[Measurement data for reference only]. |
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Suntaba Acid and Alkali Resistance Test
DIP TIME：1 HR
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suntaba T2 lifetime test
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( cold and hot shock test 1500 cycles )
Test method : SUNTABA T2 is heated at high temperature and pressed down on the "contact material" for 5 minutes, then cooled down and removed from the "contact material". This is repeated over many cycles.
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Test result : After 1,500 hot and cold shocks, the SUNTABA T2 still has adsorption effects, and impurities are found on the surface (which can be cleaned with alcohol wipe).
| 貼霸T2__冷熱衝擊1500測試.pdf |
test before
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test after which can be cleaned with alcohol wipe)
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suntaba vacUum pallets (T0/T2) surface resistance & esd test
Surface Resistance：SUNTABA TO → 10E12 Ω ; SUNTABA T2 → 10E5 Ω.
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STATIC ELECTRICITY：SUNTABA TO → 0.02 KV ; SUNTABA T2 → 0.06 KV.
※ Because the bottom Stononlead® is ESD material, it can improve the static electricity of the whole Suntaba Vacuum Pallets.
※ Because the bottom Stononlead® is ESD material, it can improve the static electricity of the whole Suntaba Vacuum Pallets.
SUNTABA VACUUM PALLETS (T0 / T2) complies with ESDS MM CLASS M1 level standards.
SUNTABA ASTM E595 OUTGASSING IN VACUUM ENVIRONMENT TEST
| ASTM E595 Outgassing In Vacuum Environment Test.pdf |
TEST ITEM |
TEST RESULTS |
STANDARDS |
TML (Total Mass Loss) |
0.580 % |
≦ 1% |
CVCM (Collected Volatile Condensable Materials) |
0.316 % |
≦ 0.1% |
WVR (Water Vapor Regained) |
0.078 % |
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SUNTABA Snake-Scale Heating Test ( Without vs. With Snake-Scale Design )
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．SUNTABA T2：115 x 60 mm
．PET Film：105 x 55 x 0.07 mm ※Left: Original SUNTABA without processing ; Right: Snake-scale processed (3 × 3 mm). ．Test Method：SUNTABA T2 was attached to a stainless steel plate. A PET film was placed on top of the pallet and confirmed to be flat without bubbles. Heating was then applied from the back side of SUNTABA. ．Test Results：When heated above 100 °C, bubbles of various sizes appeared on the PET film. |
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．Without snake-scale → Large bubbles formed, with noticeable local separation of the PET film.
．With snake-scale → Small bubbles appeared but dissipated, and the PET film remained flatly attached.
This test demonstrates that “Snake-scale technology helps maintain flat adhesion of thin films during thermal processes, preventing wrinkles.”
．With snake-scale → Small bubbles appeared but dissipated, and the PET film remained flatly attached.
This test demonstrates that “Snake-scale technology helps maintain flat adhesion of thin films during thermal processes, preventing wrinkles.”
SUNTABA T2 Room Temperature
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SUNTABA T2 Heated Above 100°C
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SUNTABA Vertical Tensile Test
SUNTABA was used to adsorb quartz glass (1.1 × 12 × 12 mm). The test measured the force required to pull the glass off vertically.
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SUNTABA® Peel Test |
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This test was conducted to evaluate whether SUNTABA T2, when adsorbed onto quartz glass under high-temperature conditions, would cause issues such as excessive bonding, adhesive residue, or inability to peel off. The purpose was to assess its suitability for high-cleanliness and repeatable adsorption operations in electronic processes.
．Test Pallet: T2
．Test Substrate: Quartz glass
．Baking Conditions: 230 °C × 5 hours
．Test Method: SUNTABA® was applied onto the surface of quartz glass and left for 48 hours to observe its peel condition. The same pallet was then cut into four strips, each applied to quartz glass, subjected to different numbers of baking cycles, and evaluated for peel performance after cooling.
．Test Pallet: T2
．Test Substrate: Quartz glass
．Baking Conditions: 230 °C × 5 hours
．Test Method: SUNTABA® was applied onto the surface of quartz glass and left for 48 hours to observe its peel condition. The same pallet was then cut into four strips, each applied to quartz glass, subjected to different numbers of baking cycles, and evaluated for peel performance after cooling.
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Test Condition |
Total Adsorption Time |
Test Result |
1 |
Room temperature, placed for 48 hours |
48 hrs |
No excessive bonding, easy peel, no adhesive residue |
2 |
Room temperature, placed for 48 hours → 1 baking cycle |
51 hrs |
No excessive bonding, easy peel, no adhesive residue |
3 |
Room temperature, placed for 48 hours → 2 baking cycle |
104 hrs |
No excessive bonding, easy peel, no adhesive residue |
4 |
Room temperature, placed for 48 hours → 4 baking cycle |
128 hrs |
No excessive bonding, easy peel, no adhesive residue |
5 |
Room temperature, placed for 48 hours → 5 baking cycle |
152 hrs |
No excessive bonding, easy peel, no adhesive residue |
．Test Result：SUNTABA T2 demonstrated stable performance under high-temperature and long-duration adsorption conditions. Regardless of single or multiple baking cycles, or prolonged adsorption, no adhesive residue or peeling difficulty was observed. This confirms its excellent heat resistance and reworkability, making it suitable for high-cleanliness and repeatable adsorption operations in electronic process environments.
applications
comparison
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Brush Adhesive Coating Carrier |
SUNTABA Vacuum Pallets |
lifetime |
LESS Unable to withstand high temperature, adhesion will gradually decrease. |
MORE Vacuum adsorption, high temperature resistance Can be used for more than 1,500 time. |
precision |
LOW Designed Precision ±0.2, thickness tolerance ±0.1. |
HIGH Designed Precision ±0.1, thickness tolerance <0.05 |
design variation |
LESS Glue and fixtures are integrated, style and adsorption force are fixed. |
MORE Customizable adsorption area and force. |
convenience |
LOW Cumbersome and lengthy process of adhesive replacement. |
HIGH Suntaba offers simple and fast replacement process. |
網印刷膠載具
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網印刷膠載具
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模具壓膠載具
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