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thin FILM/fLEXIBLE sUBSTRATES

「SUNTABA vacuum pallets」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.
​Just set it! The best solution for thin PCB and FPC production!
Due to the thin profile of mobile devices, circuit boards (PCB, substrate, FPC) are getting thinner and thinner.
  • So how can we prevent deformation when producing ultra-thin PCB?
  • How do we fix the board into position and remove the PCB when it is so thin?
  • How do we automate the production of thin PCB?
Based on the above issues, we developed the「SUNTABA vacuum pallets」, which uses the vacuum suction principle to replace the traditional taping methods. Solve the above problems easily and move towards automatic production.​

Thin PCB generally refers to the SMT process, with less than 0.6mm thickness. Commonly used materials include FR4, FPC, PI, PET, such as RFID, SD CARD, FLASH, FPC, COF ... etc. As shown in the picture, Suntaba Vacuum pallets can resolve the production problems of these substrates.
  1. Reduces deformation of the PCB and improves the yield of the assembly.
  2. Reusable, reduces emissions and is environmentally friendly.
  3. Enhances automation and reduces manpower needs.
  4. Panelized production for enhanced efficiency.​
​Thin-Film Packaging Applications — Snake-Scale™ Technology
Applying Snake-Scale™ Technology to the SUNTABA® Vacuum Pallet effectively eliminates air entrapment issues and maintains stable vacuum adsorption capability.
The unique snake-scale design releases gas and bubbles during high-temperature processes, preventing substrate warpage or deformation caused by thermal expansion. This ensures that thin films and flexible substrates remain fully flat during packaging, enhancing process precision and yield.​​
Snake-Scale Exhaust Design: Effectively releases gases generated at high temperatures, preventing bubble retention.​
  1. Customizable adsorption area: Flexible design to accommodate different product sizes and shapes.
  2. Supports both flexible and rigid substrates: Applicable to a wide range of substrate types.
  3. High-temperature resistance: Suitable for processes up to 250 °C.
  4. Outstanding durability: Reusable, resistant to molding pressure, low dust generation, and washable.​
SUNTABA
Thickness
T2 PLUS (green)
0.5 mm ​± 0.05
T2 (black)
0.5 mm ​± 0.05
Carrier Material
Deformation
quartz glass
0.1 mm
stononlead
0.6 mm
This technology not only mitigates substrate thermal expansion issues during processing but also resolves downstream challenges in die bonding and wire bonding caused by deformation, ensuring greater stability in high-precision packaging processes.​

SUNTABA Snake-Scale Heating Test ( Without vs. With Snake-Scale Design )

．SUNTABA T2：115 x 60 mm
．PET Film：105 x 55 x 0.07 mm
※Left: Original SUNTABA without processing ; Right: Snake-scale processed (3 × 3 mm).

．Test Method：SUNTABA T2 was attached to a stainless steel plate. A PET film was placed on top of the pallet and confirmed to be flat without bubbles. Heating was then applied from the back side of SUNTABA.
​
．Test Results：When heated above 100 °C, bubbles of various sizes appeared on the PET film.
．Without snake-scale → Large bubbles formed, with noticeable local separation of the PET film.
．With snake-scale → Small bubbles appeared but dissipated, and the PET film remained flatly attached.

This test demonstrates that “Snake-scale technology helps maintain flat adhesion of thin films during thermal processes, preventing wrinkles.”
貼霸T2 常溫
SUNTABA T2 Room Temperature
貼霸T2 加熱100°C以上
SUNTABA T2 Heated Above 100°C