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Home  >  Applications of Suntaba  >  SUNTABA VAC-SORB

【SUNTABA VACcum plate​】

SUNTABA VACCUM PLATE​.pdf
File Size: 1975 kb
File Type: pdf
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「SUNTABA vaccum plate」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.
​Just set it! The best solution for thin PCB and FPC production!
Due to the thin profile of mobile devices, circuit boards (PCB, substrate, FPC) are getting thinner and thinner.
  • So how can we prevent deformation when producing ultra-thin PCB boards?
  • How do we fix the board into position and remove the PCB board when it is so thin?
  • How do we automate the production of thin boards?
Based on the above issues, we developed the Suntaba Vac-Sorb, which uses the vacuum suction principle to replace the traditional taping methods. Solve the above problems easily and move towards automatic production.
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suntaba_msds.pdf
File Size: 260 kb
File Type: pdf
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suntaba(T0)_SGS(2021).pdf
File Size: 450 kb
File Type: pdf
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suntaba(T2)_SGS(2021).pdf
File Size: 450 kb
File Type: pdf
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SUNTABA can be custom designed according to different products and manufacturing.
SUNTABA designed
SUNTABA designed
SUNTABA design:If the SUNTABA is used with full glossy surface, the adsorption strength may be too large, causing the substrate to be deformed or damaged when separated.
After design, the adsorption area and adsorption strength of the sticker can be determined and adjusted.
  1. Round design:with the use of manual and automatic ejectors, the rounded design can adjust the strength of each ejector hole on the Suntaba.
  2. Striped design:The striped design of the non-adsorption area can effectively reduce the adsorption force by 50% in the target area.
  3. Irregular design:For complex and irregular substrates, special shapes can be custom designed.
  4. Snake-scale design:Sunny Process's newly developed "Snake-scale technology" is designed for high end packaging and semiconductor production processes. It can regulate the thermal expansion of the packaging process when exposed to heat
貼霸®的設計與應用.pdf
File Size: 1248 kb
File Type: pdf
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SUNTABA - round design
SUNTABA - striped design
SUNTABA - irregular design
SUNTABA - snake-scale design

advantages

  1. The lifetime of SUNTABA is more than 1,500 : vacuum adsorption technology is adopted so no tape is required (the lifetime of Suntaba varies depending on the use method and environment).
  2. ​Cost-saving : SUNTABA can be replaced so carriers can be reused.
  3. Improved production yield : prevent FPC deformation during production.
  4. Complex FPC layout design : precision cutting (±0.1 mm).
  5. SUNTABA can be designed with partial adsorption surface : the adsorption and non-adsorption area can be realized on the same in-place sticker.
  6. Convenient automatic production : can be quickly positioned and detached.
  7. Small thermal expansion coefficient : automatic production, to avoid fixture deformation and production line jamming issues. (Reference materials)
  8. SUNTABA can be reused to solve tape waste contamination.
  9. Anti-static SUNTABA T2 is also available (10E4~10E7 Ω).
  10. Can be used with hand-held dusting roller to improve cleanliness.
Suntaba can be designed with partial adsorption surface.
Precision cutting
Suntaba can be replaced
Can be used with hand-held dusting roller

NOTES

  1. Do not use toluene, acetone, IPA and other substances on SUNTABA.
  2. ​To clean your SUNTABA, it is recommended to use hand-held dust roller, neutral detergent + water.
  3. The useful lifetime of the SUNTABA will be affected by duration and temperature during use.
  4. After the PCB is completed, it is recommended that the board be ejected at a temperature of about 50 ~ 60°C to prevent damage to the PCB. ​
  5. If the board’s RA value is greater than 0.1, it is recommended to use the SUNTABA T0.

feature

SUNTABA.pdf
File Size: 353 kb
File Type: pdf
下載檔案

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SUNTABA test

  • Ejecting Force Test
  • Acid and Alkali Resistance Test
  • Lifetime Test
  • ESD & Surface Resistance Test
  • ASTM E595 Test
<
>

sUNTABA EJECTING FORCE TEST 1

This tests the force required for SUNTABA to eject the PET film (thickness 0.07mm).
The area in black is the adsorption area.   [Measurement data for reference only].

貼霸頂出測試 示意
SUNTABA T0 -- Ejecting Force Test Results
A 
1.5 mm
2 mm
3 mm
4 mm
Max (g)
47
59
79
105
Min (g)
27
40
56
70
Average (g)
35
50
65
95
SUNTABA T2 -- Ejecting Force Test Results
A
1.5 mm
2 mm
3 mm
4 mm
Max (g)
26
42
58
66
Min (g)
23
30
42
52
Average (g)
25
35
50
60

SUNTABA EJECTING FORCE TEST 2

This tests the force required by SUNTABA T2 to eject the glass (thickness 1.1mm). The area in black is the adsorption area.
​[Measurement data for reference only].
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B
4.7 mm
3 mm
Max (g)
900
710
Min (g)
660
540
Average (g)
715
635

Suntaba Acid and Alkali Resistance Test

DIP TIME:1 HR
CHEMICAL
CONC.
TEMP
RESULT
KOH
1%
R.T
OK
Na2CO3
1%
R.T
OK
NaOH
1%
R.T
OK
​NaOH
5%
R.T
OK
​NaOH
5%
50​℃
OK
FeCl3
-
R.T
OK
FeCl3
-
50​℃
OK
CuCl2
-
R.T
OK
​CuCl2
-
50​℃
OK
HCl + H2O2
30% / 30%
R.T
OK
Ti etching
5%
R.T
OK

suntaba T2 lifetime test

( cold and hot shock test 1500 cycles )
Test method : SUNTABA T2 is heated at high temperature and pressed down on the "contact material" for 5 minutes, then cooled down and removed from the "contact material". This is repeated over many cycles.
SUNTABA
contact material
heated
​cooled
time
number
T2
0.2mm
Stononlead®
260℃
175℃
5 minute
1,500
Test result : After 1,500 hot and cold shocks, the SUNTABA T2 still has adsorption effects, and impurities are found on the surface (which can be cleaned with alcohol wipe).
貼霸T2__冷熱衝擊1500測試.pdf
File Size: 1724 kb
File Type: pdf
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test before
test before
test after which can be cleaned with alcohol wipe)
test after which can be cleaned with alcohol wipe)

suntaba vaccum plate (T0/T2) surface resistance & esd test

Surface Resistance:SUNTABA  TO → 10E12 Ω ; SUNTABA  T2 → 10E5 Ω.
T0抗靜電值
T2抗靜電值
STATIC ELECTRICITY:SUNTABA  TO → 0.02 KV ; SUNTABA  T2 → 0.06 KV.
※ Because the bottom Stononlead® is ESD material, it can improve the static electricity of the whole Suntaba Vaccum Plate.
T0靜電壓值
( T0 video )
T2靜電壓值
( T2 video )
​​ SUNTABA VACCUM PLATE(T0 / T2) complies with ESDS MM CLASS M1 level standards.

SUNTABA ASTM E595 OUTGASSING IN VACUUM ENVIRONMENT TEST

ASTM E595 Outgassing In Vacuum Environment Test.pdf
File Size: 295 kb
File Type: pdf
下載檔案

TEST ITEM
TEST RESULTS
STANDARDS
TML  (Total Mass Loss)
0.580 %
≦ 1%
CVCM  (Collected Volatile Condensable Materials)
0.316 %
≦ 0.1%
WVR  (Water Vapor Regained)
0.078 %
-

application scope

mini LED製程
Mini LED Process
半導體封裝
Semiconductor Packaging Process
玻璃基板/WAFER
Glass Substrate / WAFER
薄型/軟性基板
Thin / Soft PCB Process
Can be combined with automatic load unload device.
Can be used with robotic arms.
(Applicable to varying production line methods.)​​​
  1. Option 1:Manual separation. ( video )
  2. Option 2:Semi-automatic separation. (pneumatic / stepping motor)  ( video )
  3. Option 3:Off line fully automatic separation.
  4. Option 4:On line fully automatic separation.
貼霸載具搭配機器手臂使用
封裝級載具:貼霸®_結合蛇鱗技術.pdf
File Size: 1385 kb
File Type: pdf
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貼霸®案例介紹:fr4與fpc之應用.pdf
File Size: 229 kb
File Type: pdf
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貼霸®案例介紹:穿戴裝置之應用.pdf
File Size: 143 kb
File Type: pdf
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貼霸®載具—light_bar應用.pdf
File Size: 199 kb
File Type: pdf
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貼霸®晶片轉移.pdf
File Size: 304 kb
File Type: pdf
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suntaba - fully automatic production process

suntaba - manual production process

suntaba - manual ejection

suntaba - semi-automatic ejection  ( full version )


applications


comparison

.
Brush Adhesive Coating Carrier
SUNTABA Vaccum Plate
lifetime
LESS
Unable to withstand high temperature, adhesion will gradually decrease.
MORE
Vacuum adsorption, high temperature resistance
Can be used for more than 1,500 time.
precision
LOW
Designed Precision ±0.2, thickness tolerance ±0.1.
HIGH
Designed Precision ±0.1, thickness tolerance <0.05
design
​variation

LESS
Glue and fixtures are integrated, style and adsorption force are fixed.
MORE
Customizable adsorption area and force.
convenience
LOW
Cumbersome and lengthy process of adhesive replacement.
HIGH
Suntaba offers simple and fast replacement process.
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網印刷膠載具
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網印刷膠載具
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模具壓膠載具

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需要我們的服務嗎 ? 請聯絡我們。
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