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Advanced Semiconductor Packaging Processes

「SUNTABA vacuum pallets」complies with SGS's RoHS 2.0, PFOS, PFOA, and halogen-free environmental testing standards.
The SUNTABA Vacuum Pallet has diverse applications in semiconductor manufacturing. Its use demonstrates significant advantages in precision positioning and stability, playing a key role in meeting the high-precision requirements of semiconductor processes and ensuring yield.
  1. Wafer Handling: In wafer manufacturing, SUNTABA® vacuum pallets are used for handling and positioning wafers, ensuring they are not damaged by vibration or slippage during transfer.
  2. Packaging Processes: In semiconductor packaging, SUNTABA® vacuum pallets secure wafers or substrates, facilitating subsequent soldering, packaging, and testing.
  3. Inspection & Testing: During inspection and testing of finished wafers or substrates, SUNTABA® vacuum pallets stabilize test pieces, ensuring accuracy of test data.
  4. Precision Assembly: In processes requiring high-precision assembly, such as chip bonding or micro-component assembly, SUNTABA® vacuum pallets effectively secure and position workpieces, improving assembly quality and efficiency.​​

Sandwich Wafer Magnetic Pallet

Stable adsorption without adhesive residue, easy separation, reusable, and more eco-friendly for production!
With the rapid development of Advanced Packaging technology, the “Sandwich” Wafer Magnetic Pallet was developed to provide more stable and efficient support solutions for Glass Substrate and Wafer-Level Packaging processes, further enhancing precision and yield in semiconductor manufacturing.​
Breakthrough in Traditional Adsorption Technology — High-Efficiency Magnetic Solution
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​The “Sandwich Wafer Magnetic Pallet” is designed with advanced precision materials, integrating adsorption, magnetic holding, and planarization functions. Through its multilayer “sandwich” structure, it can be flexibly assembled and disassembled according to different process requirements, ensuring stability and adaptability during manufacturing.​
Key Features of the Sandwich Wafer Magnetic Pallet:​
  1. Strong magnetic + vacuum adsorption: Provides stable support and effectively prevents deformation of glass substrates and wafers.
  2. Residue-free & reusable: Eco-friendly and cost-efficient by reducing consumables.
  3. Detachable steel structure: Adapts to different substrate and wafer thicknesses, enabling flexible application across processes.
  4. High heat and chemical resistance: Suitable for high-temperature baking, grinding, and acid/alkaline processes.

Applicable to critical processes in advanced packaging and wafer-level manufacturing, such as:
  1. Grinding: Stabilizes glass substrates, reducing warpage and damage.
  2. Baking: High-temperature resistance ensures no deformation during processing.
  3. Chemical Etching: Withstands various chemical treatments without compromising adsorption.
  4. Die Bonding: Serves as a stable adsorption base to support accurate die bonding and positioning.
  5. Transfer Molding: Supports substrates during molding, achieving stable demolding and transfer under high temperature and pressure.
After multiple process steps, thin glass substrates and wafers can still maintain excellent flatness, preventing bending or warpage and ensuring stability and precision.
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Water Debonding Method
Wafer separation from SUNTABA® can be achieved using the water debonding method.
Method: Place the sandwich magnetic pallet with the attached wafer into water and break the vacuum state from the edge, allowing the wafer to naturally detach.
No high temperature, no chemical solvents, and no adhesive residue — safe and eco-friendly, especially suitable for ultra-thin wafers or fragile substrates.
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Enhancing Yield and Enabling Efficient Production with the Sandwich Wafer Magnetic Pallet
✅ High Strength: Ensures stable support under high-stress conditions.
✅ Excellent Flatness: Improves process accuracy and reduces defect rates.
✅ Flexible Adaptability: Meets diverse processing challenges in advanced packaging.
Sunny Process Co., Ltd. proudly introduces the “Sandwich” Wafer Magnetic Pallet to help you tackle semiconductor packaging challenges with improved yield and higher productivity!

SUNTABA ACID AND ALKALI RESISTANCE TEST

DIP TIME：1 HR
CHEMICAL
CONC.
TEMP
RESULT
KOH
1%
R.T
OK
Na2CO3
1%
R.T
OK
NaOH
1%
R.T
OK
​NaOH
5%
R.T
OK
​NaOH
5%
50​℃
OK
FeCl3
-
R.T
OK
FeCl3
-
50​℃
OK
CuCl2
-
R.T
OK
​CuCl2
-
50​℃
OK
HCl + H2O2
30% / 30%
R.T
OK
Ti etching
5%
R.T
OK

Applications